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Checklist: Electronic Hardware Equipment and Product Design Development for Manufacturing (DfM)

  • Mark Zetter

Mark Zetter

04 Apr 2024
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Semiconductor Duty Stacking: Tracking Tariff Exposure When Your Chip Crosses Four Borders

A single integrated circuit can cross four national borders between wafer start and delivery to your dock. Each crossing involves a different manufacturing stage, a different HTS classification, and potentially a different duty rate. For procurement teams managing semiconductor BOMs with hundreds of line items, cumulative tariff exposure across multi-stage
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The Manufacturing Conversation Most Hardware Startups Don't Have Early Enough

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Most hardware startup founders treat manufacturing as a milestone. Something that happens after the prototype works, after the pitch deck is polished, after the funding closes. By the time they start emailing factories, they are already behind. The gap is not ambition or technical capability. The gap is preparation. A
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USMCA Rules of Origin and Automotive Electronics: Tariff Implications for Cross-Border Sourcing

Mexico is the default answer when North American automotive OEMs look for lower-cost electronics assembly. Labor costs are lower, the manufacturing infrastructure is mature, and USMCA promises duty-free treatment for qualifying goods crossing the US-Mexico border. The promise is real - but the qualification requirements are specific, component-level, and unforgiving.
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